Failure Mode and Effects Analysis of PCB for Quality Control Process
نویسندگان
چکیده
The aim of this study is to highlight the key elements for optimizing printed circuit board (PCB) fabrication productivity through improving manufacturing process efficiency. Failure mode and effect analysis (FMEA) a technique used reduce percentage finished goods that are found be defective during final inspection, resulting in low rejection ratios optimized PCB design. This paper presents all quality steps achieve high efficiency done electronics industry which its production begins from receiving PCBs, raw material then bringing them into punching assembly processes surface mount machines (SMT). To find items lower possibility products, or IPQC (in-process control), used. average customer manufacturers lot reject rate (%LRR CMs) has been improved by using control. For assessing risk connected probable issues discovered failure effects analysis, priority number (RPN) methodology applied. FMEA RPN assists responsible team individual prioritizing risks choosing appropriate remedial measures. Lot (LRR) 5500 parts per million (PPM) 900 (PPM), faults have decreased 0.76% as result
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ژورنال
عنوان ژورنال: Mapan-journal of Metrology Society of India
سال: 2023
ISSN: ['0974-9853', '0970-3950']
DOI: https://doi.org/10.1007/s12647-022-00619-5